Moldex3D 2026: Hot Runner Speed Gains, AI-Driven Defect Prediction, and Advanced IC Packaging Simulation
CoreTech System has released Moldex3D 2026, delivering a 4x or greater speed improvement for multi-cavity hot runner analysis, a fully upgraded crystallization solver using the Dual Nakamura Model, and new Hybrid Zone and EBG technologies that cut semiconductor packaging simulation times by up to 15x. The release also deepens AI integration through the iSLM Discovery series, AI Chat diagnostics, and an expanded Moldibot with 'Deep Thinking' capabilities.